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Director, Thin Film Development

Intel US, Oregon, Hillsboro onsite
full-time
211400 - 298440 USD
Posted on 12 February 2026

Overview

Lead thin-film deposition engineering to develop and scale advanced CMOS processes for Intel Foundry in Hillsboro, driving manufacturability, yield, and HVM ramp.

Requirements

• Deep expertise in thin film deposition processes (CVD, ALD, PVD, thermal/plasma processes, epi, furnace, anneal). • Experience scaling processes to High Volume Manufacturing and leading factory ramps. • Hands-on familiarity with deposition equipment and suppliers (AMAT, LAM, ASM). • Strong process integration and cross-module collaboration (etch, litho, device, metrology). • Data-driven problem solving, statistical analysis and process capability improvement. • Proven people management and program leadership skills in multi-national manufacturing settings. • Excellent written and verbal communication with executive and technical audiences. • Experience with yield improvement, defect reduction and reliability considerations.

About Company

Intel

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