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Director, Thin Film Development
Intel US, Oregon, Hillsboro onsite
full-time
211400 - 298440 USD Posted on 12 February 2026
Overview
Lead thin-film deposition engineering to develop and scale advanced CMOS processes for Intel Foundry in Hillsboro, driving manufacturability, yield, and HVM ramp.
Requirements
• Deep expertise in thin film deposition processes (CVD, ALD, PVD, thermal/plasma processes, epi, furnace, anneal).
• Experience scaling processes to High Volume Manufacturing and leading factory ramps.
• Hands-on familiarity with deposition equipment and suppliers (AMAT, LAM, ASM).
• Strong process integration and cross-module collaboration (etch, litho, device, metrology).
• Data-driven problem solving, statistical analysis and process capability improvement.
• Proven people management and program leadership skills in multi-national manufacturing settings.
• Excellent written and verbal communication with executive and technical audiences.
• Experience with yield improvement, defect reduction and reliability considerations.
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